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DFM


PARAMETERS  STANDARD CRITICAL
Layer Count Upto 12 Layer 12 to 32 Layers
Min Hole size. [DRILL DIA] 10 mil 8 & 6 mil
Minimum size of slot 0.70 mm 0.50 & 0.60 mm
Minimum Annular Ring for via holes [Inner & outer] 6 & 4 mil 2 & 3 mil
Minimum Annular Ring for component holes [Inner & outer] 6 mil 4 mil
Minimum Outer layer track / space 4/4 mil 3/3 mil
Minimum inner layer track / space 4/4 mil 3/3 mil
Minimum inner layer (Antipad) drill to copper isolation 8 mil 4 mil
Minimum board edge to copper clearance [Routed Boards] 6 mil 4 mil
Minimum board edge to copper clearance [Scored Boards] 16 mil 16 mil
Minimum Solder Mask Clearance 2 mil 1 mil
Minimum width of Solder Mask dam 4 mil 3 mil
Minimum total width for legend printing 6 mil 4 mil
Minimum SMD pitch 20 mil 16 mil
Minimum BGA pitch 24 mil 16 mil
Aspect Ratio (Thickness to Drill) 12:01 16:01
Blind Via  1 + N + 1 1 + N + 1
Burried Via

Internal Layers Connectivity Leaving
leaving Top & Bottom Layer

Hole Fill / Cap Plate  ( Min. Hole ) 8 mil <8 mil
Control Impedance Toll. +/- 10% Toll. +/- 5%