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Capabilites
Highlights of Capability
  • MULTILAYER PCBs UPTO 32 LAYERS
  • 4 MIL & BELOW DENSITY
  • 8 MIL & BELOW VIAS
  • CONTROLLED IMPEDANCE MATCHING
  • BLIND (1+N+1) & BURRIED VIAS
  • ENIG FINISH
  • PLASMA TECHNOLOGY